Silver has excellent electrical conductivity, making silver bonding wire an ideal material for connections between components. Its high electrical conductivity enhances signal transmission between components, which is critical for high-performance and high-frequency operation of ICs. The wire's thinness and flexibility make it ideal for making the extremely small diameter bonds often required in modern ICs.
Silver bonding wires are also favored for their excellent thermal and mechanical properties. The thermal properties of this wire make it a good material for use in equipment that generates large amounts of heat at high operating temperatures. In addition, the wire's mechanical properties, such as ductility and elasticity, make it resistant to cracking and fracture even under conditions of mechanical stress generated by thermal cycling.